https://doi.org/10.1140/epjs/s11734-025-01556-5
Regular Article
FEA study on liquid droplet stamp contact of thin film devices
1
Center for Mechanics Plus Under Extreme Environments, School of Mechanical Engineering and Mechanics, Ningbo University, 315211, Ningbo, China
2
Department of Urology, The First Affiliated Hospital of Ningbo University, 315010, Ningbo, Zhejiang, China
3
Shaoxing Yuanju Technology Co., Ltd, 311816, Shaoxing, Zhejiang, China
a
fyywukerong@nbu.edu.cn
b
shichuanqian@nbu.edu.cn
Received:
28
December
2024
Accepted:
27
February
2025
Published online:
17
March
2025
Transfer printing technology is a cornerstone for enabling the heterogeneous integration of thin films onto flexible substrates in advanced flexible electronics. Liquid-phase stamps have garnered attention as a viable alternative, addressing the inherent limitations of conventional elastomeric stamps, which often induce significant mechanical damage to delicate thin-film devices due to excessive contact forces. Nevertheless, the intrinsic fluidity of liquid droplets introduces substantial complexity to the interfacial mechanics during the contact process. While numerous theoretical models exist to describe the adhesion mechanisms of various interfaces, finite element analysis (FEA) offers significant advantages for analyzing complex scenarios. In this study, based on fluid structure interaction (FSI) theory, FEA was employed to simulate the contact process of thin-film devices in liquid stamp transfer printing. The simulated transverse and longitudinal stress–strain responses of the thin-film devices under applied strains were analyzed, confirming that the process does not cause device rupture or damage. Additionally, key parameters such as surface tension, categories of materials, and radius were varied in the simulations, providing direct theoretical insights and a scientific foundation for the optimization of liquid stamps. Furthermore, a comparison with elastomer stamps demonstrated that liquid stamps exhibit superior resistance to the destruction of thin-film devices during the contacting process.
Supplementary Information The online version contains supplementary material available at https://doi.org/10.1140/epjs/s11734-025-01556-5.
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Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
