https://doi.org/10.1140/epjs/s11734-025-01553-8
Regular Article
Mechanics-based design and optimization for M-loop wirebonding in flexible electronics
1
Laboratory of Flexible Electronics Technology, Tsinghua University, 100084, Beijing, China
2
Department of Engineering Mechanics, AML, Tsinghua University, 100084, Beijing, China
3
Institute of Flexible Electronics Technology of THU, 314000, Jiaxing, China
a
mayinji@tsinghua.edu.cn
b
fengxue@tsinghua.edu.cn
Received:
10
October
2024
Accepted:
27
February
2025
Published online:
27
March
2025
Wirebonding is widely recognized as one of the most reliable methods for interconnecting circuits. Extensive research has been conducted in various areas, such as processing, materials, and wire-loop design, to ensure the reliability of wirebonding. While the studies of capability of deformation in wirebonding, e.g., stretching or bending, which is the essential advance in flexible electronics, have not been launched. This paper presents an investigation into the impact of wire-loop shape on the reliability of flexible circuits under a given-curvature bending loads. With a linearly elastic multi-segment curve beam model, the maximum stress of both Q-loop wire and M-loop wire was obtained and considered as the indicator of fatigue failure. Finite element analysis and cyclic bending tests were used to examine the influence of loop shape on the reliability. In addition, this paper shows how the Particle Swarm Optimization (PSO) algorithm helps to get the optimized loop shape of M-loop wire to minimize the stress and length for a better mechanical and electrical performance.
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© The Author(s), under exclusive licence to EDP Sciences, Springer-Verlag GmbH Germany, part of Springer Nature 2025
Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
