EPJ ST Special issue: Flexible Electronic Devices: Mechanics Design and Applications
- Details
- Published on 01 October 2024
Guest Editors: Chengjun Wang, Yinji Ma, Rui Li
Flexible electronic devices have significantly broadened the application scope of conventional rigid electronics, especially in the field of biomedicine, robotics, and human-machine interaction, garnering substantial attention from both academia and industries. Examples of flexible electronic devices include soft/stretchable electronics, bio-integrated electronics, flexible energy-harvesting devices, flexible ultrasonic devices, reconfigurable electronic, origami and kirigami-based electronics, flexible metamaterials/metasurfaces, and soft actuator/robots. These emerging flexible devices have undergone extensive development in recent years, primarily employing mechanics design strategies to achieve superior stretchability and conformalability for seamless integration with soft, deformable complex surfaces (e.g., tissues and machines) while maintaining the stable functionalities even under large deformations.
This Special Issue aims to seek submissions of your original research articles and reviews focusing on both the mechanics design and innovative applications of flexible electronic devices. Potential topics encompass but are not limited to the following:
- Mechanics and physics of flexible electronic devices
- Wearable or implantable electronics
- Flexible energy-harvesting devices
- Flexible ultrasonic devices
- Physically transient electronics
- Reconfigurable electronics
- Flexible metamaterials or metasurfaces
- Flexible electronic devices for healthcare
- Flexible electronic devices for intelligent machines
Articles should be submitted to the Editorial Office of EPJ ST via the submission system, and should be clearly identified as intended for the topical issue “Flexible Electronic Devices: Mechanics Design and Applications”.
Submissions should follow the guidelines of EPJ Special Topics, which can be found here. For the preparation of the manuscripts a special latex template (preferably single-column layout) is available here.
Guest Editors:
Dr. Chengjun Wang, Huanjiang Laboratory, Department of Engineering Mechanics, Zhejiang University, Hangzhou 310027, China, Email: This email address is being protected from spambots. You need JavaScript enabled to view it.
Dr. Yinji Ma, IDepartment of Engineering Mechanics, Tsinghua University, Beijing 100084, China, Email: This email address is being protected from spambots. You need JavaScript enabled to view it.
Dr. Rui Li, Institute of Engineering Mechanics, Dalian University of Technology, Dalian 116024, China, Email: This email address is being protected from spambots. You need JavaScript enabled to view it.
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